Sistema di segatura a diamanti a fili multipli per materiali fragili a SiC / zaffiro / ultra-duri

Video Description:
Discover the Multi-Wire Diamond Sawing System, designed for precision slicing of ultra-hard materials like SiC, sapphire, and GaN. This advanced machine boosts efficiency with high-throughput cutting, ensuring superior surface quality and dimensional accuracy for semiconductor, photovoltaic, and LED industries.
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