Breve: Scopri l'apparecchiatura per il sollevamento laser a semiconduttore, una soluzione all'avanguardia per l'assottigliamento non distruttivo degli lingotti nella lavorazione dei semiconduttori. Questa piattaforma avanzata basata su laser offre un taglio di precisione di strati ultrasottili da lingotti sfusi, riducendo gli sprechi e migliorando l'integrità del substrato per i dispositivi di prossima generazione.
Caratteristiche del prodotto correlate:
Contact-free, non-destructive thinning for brittle materials like GaN, SiC, and sapphire.
Precision slicing of wafer-scale films with minimal material waste.
Automated control and beam shaping for seamless integration into fabrication workflows.
Supports R&D flexibility and mass production scalability.
Motion-synchronized scanning heads for precise energy delivery.
Reduces microcracking, bowing, and surface chipping risks.
Configurable with burst-mode or multi-pulse capabilities for smooth detachment.
Ideal for power electronics, RF systems, photonics, and micro-displays.
FAQ:
What is the minimum thickness achievable with the Semiconductor Laser Lift-Off Equipment?
Typically between 10-30 microns, depending on the material, with potential for thinner results using modified setups.
Can the equipment slice multiple wafers from the same ingot?
Yes, the laser lift-off technique allows for serial extractions of multiple thin layers from one bulk ingot.
How does the system compare to diamond wire saws in terms of cost?
While initial capex may be higher, laser lift-off reduces consumable costs, substrate damage, and post-processing steps, lowering total cost of ownership long-term.