Vetro a vetro trasparente (TGV)

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Vetro a vetro trasparente (TGV)

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May 31, 2024

Connessione Categoria: substrato dello zaffiro

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Tag:

#wafer dello zaffiro #substrato di silicio #materiale dello zaffiro

Breve: Discover the innovative Through-Glass Vias (TGV) technology for JGS1, JGS2, sapphire, and Corning glass, designed for sensor manufacturing and packaging. Enhance performance and reliability in automotive, aerospace, medical, and consumer electronics with our advanced TGV solutions.

Caratteristiche del prodotto correlate:

Enables device miniaturization with compact interconnect solutions.
Supports anodic bonding with silicon wafers, eliminating out-gassing issues.
Superior high-frequency characteristics ideal for RF applications.
Precise via pitch tolerance of less than ±20μm per 200mm wafer.
Adattabile a wafer fino a 200mm di diametro.
Laser-induced etching ensures crack-free blind and through vias.
High aspect ratios and high-density vias for modern technology demands.
Widely used in high-performance computing, 5G, IoT, and sensor packaging.

FAQ:

What is Through Glass Via (TGV) technology?

TGV technology is a microfabrication technique for creating vertical electrical connections through glass substrates, essential for advanced electronic packaging and high-density integration.
Quali sono le applicazioni del TGV nei semiconduttori?

Nei semiconduttori, la tecnologia TGV è utilizzata per l'integrazione ad alta densità, le prestazioni ad alta frequenza e una migliore stabilità termica e meccanica in applicazioni come il 5G, l'IoT e l'imballaggio dei sensori.
What materials are compatible with TGV technology?

TGV technology is compatible with premium materials such as JGS1, JGS2, sapphire, and Corning glass, making it versatile for various high-performance applications.

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